Manufacturing

manufecThe ÅAC Microtec clean room facility dedicated to MEMS and thin film metallization is located at the Ångström laboratory and presents an excellent platform for both challenging developments and small scale manufacturing. 

ÅAC Microtec performs thin film metallization development on a wide range of materials such as LTCC, Si, Ge, Ferrite (magnet) and polyimide. Our services include ENIG and ENEPIG, Solder mask deposition, Zincation, Sputtering of Cu and TiW, Electroplating of Cu routing and vias, Electroplating of solder for bumping, Evaporation and etching of a variety of metals. ÅAC Microtec's engineers are always up for a challenge and we gladly set up and develop new processes tailored to our customers’ specific requirements.

So, please contact us with your request and we will do our foremost to support your journey from conceptual design to small and midsize manufacturing.

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ÅAC Microtec AB
Uppsala Science Park
Dag Hammarskjölds Väg 48
SE-751 83 Uppsala
Sweden
Tel. +46 18 56 01 30
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Contact ÅAC USA: This email address is being protected from spambots. You need JavaScript enabled to view it.  
USA toll free Tel.  +1 (844) 831-7158

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