Miniaturization of electronics

alltmonterat1
 

Breakthrough advantages in industrial and space product development

Miniaturized computing power for tough tasks and hostile conditions
ÅAC Microtec’s miniaturized electronics systems tolerate the explosive forces of being launched into space and the hostile conditions found there. Furthermore, we make them up to 200-times smaller and 70-times lighter than conventional solutions. One of our devices – packed with high-performance, FPGA-based computing power – weighs just 3 grams. That includes a complete functional system containing logic, memory, power-handling and control interfaces for micromechanical sensors – an all-in-one solution known as a System-in- Package (SiP).

Small, light and very robust
For demanding applications where space is at a premium, SiP solutions beat standard circuit-board approaches every time. Smaller, lighter, more robust and much easier to locate, they offer breakthrough advantages for developers of industrial products. Handling distributed intelligence in the joints of robotic arms and improving the performance of advanced construction equipment and power tools are tasks that our SiP solutions accomplish with ease. In addition, testing complex microchips by attaching interposers developed with XiVIA™ TSV technology will increase chip yield and cut the cost of production.

Fast and efficient. Easy to integrate
All our devices feature a high package density, which means fewer interconnect routing problems and reduced time delay for high-speed signals. They are also flexible and easy to integrate. nanoRTU, for example, functions either as an onboard computer with redundant interfaces or as a standard interface module with plug-and-play capabilities. Finally, their small size and weight makes it easy to build in redundancy for critical applications. Whatever your application, we offer fast time-to-market product development plus volume manufacturing.

In figures, we make electronics 15-70 lighter and 30-200 times smaller compared to conventional solutions. In practice, one of our4grams instrument control computers – complete with 40 MIPS of computing power and field programmable gate array (FPGA) – weighs in at just 4 grams.

Benefits
By making electronic systems smaller and packaging them together with MEMS sensors/actuators, you gain a wide range of different advantages.

Robust
The lighter the system, the less it is effected by mechanical vibration and acceleration. Thanks to our space heritage, our products have been designed from the outset to withstand extreme conditions including radiation.

Ubiquitous sensoring
With extremely small MEMS sensors and 3D-packaged electronics you can place sensors virtually anywhere. For example, you could monitor equipment in harsh environments, in real-time, to help increase reliability and uptime.

System redundancy
Due to the small size and weight of our products, it is simple to build redundancy in critical applications.

Heat management
ÅAC Microtec miniaturized systems are based on silicon or ceramic substrates which offer far superior heat management than conventional PCB technology. In addition, our products can tolerate extreme temperature swings (-120 °C to 220 °C) due to the materials and proprietary processes used.

Faster, more efficient
We achieve a high package density by stacking vertically. This results in fewer interconnect routing problems, less time delay for high speed signals (reduced crosstalk), less thermal problems, plus a more robust system. In other words, our technology provides excellent performance/mass/volume ratios.

Multifunctional and easy to integrate
Despite their small size, our products are flexible and easy to integrate. For example, the miniaturized product can be compliant with the Space Plug-and-play Avionics (SPA) standard and function either as an onboard computer with redundant interfaces or as a standard interface module with plug-and-play capabilities.

Right Now

Contact Us

ÅAC Microtec AB
Uppsala Science Park
Dag Hammarskjölds Väg 48
SE-751 83 Uppsala
Sweden
Tel. +46 18 56 01 30
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.
Contact ÅAC USA: This email address is being protected from spambots. You need JavaScript enabled to view it.  
USA toll free Tel.  +1 (844) 831-7158

Follow Us

    

 ×