Ongoing Projects

NAPA 3 - Nanosatellite Plug-And-Play Architectures

Nanosatellite Plug-and-Play Architectures (NAPA 3)                                                                                  

ÅAC Microtec is prime contractor

Customers are U.S. Air Force Research Laboratory and Swedish Defense Materiel Administration (FMV)

 AAC is contracted by AFRL/FMV to build the first Swedish military satellite and develop a

 satellite architecture for rapid response using AAC’s products, which among other things include CDH and power subsystems.

InnoSat - phase 3

Implementation of the new and innovative satellite architecture for a micro-satellite (40kg).

Customer is SNSB.

ÅAC Microtec and OHB Sweden have been commissioned by SNSB to implement the cost-effective microsatellite, InnoSat. The two companies' extensive expertise, innovative products and efficient work approaches are combined in a successful manner, giving Sweden the opportunity to build satellites at a very competitive price. AAC provide CDH and power subsystems and helps as well out with integration.


ÅAC Microtec is prime supplier of avionics for the Scientific Handling Unit (SHU) of Risesat.op risesat forweb

Customer is Tohoku University, Japan.
The basis is that they would like to reduce the integration time and evaluate the plug-and-play concept and use the ÅAC Rapid Integration Architecture (RIA) family of products for their scientific instruments


ÅAC Microtec is prime contractor

Customer is ESA (ARTES 5.2)                                                                                    

AAC leads the development of an ESA harmonized miniaturized Point Of Load (POL) component (DC/DC converter). It is designed for 18 years of operation in Geo-stationary Orbit (GEO). 

System in Package - Quality Assurance of ÅAC Technology: 

Quality Assurance of ÅAC Technologyop sip forwebb

AAC Microtec prime contractor

Customer is ESA (GSTP)
ESA has placed an on-going project with ÅAC to qualify robust electronic packaging techniques for cold space environments (-120 ºC to +70 ºC). The project aims at taking ECSS-Q-05-draft c (Hybrid standard) to include thru-silicon-via (TSV) technologies for silicon interposers and flip-chip soldering methods.






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ÅAC Microtec AB
Uppsala Science Park
Dag Hammarskjölds Väg 48
SE-751 83 Uppsala
Tel. +46 18 56 01 30
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