• Faster and less expensive silicon interposers
• New solutions for obsolete parts and footprints
• Greatly reduced main board complexity
• Easy to add additional/custom features
• Purely custom solutions built around standardized templates
• Mechanically and thermally-strong vias
• Rapid design, prototyping and production from small to large volumes
• Passes space environmental requirements

Interposer application focus

Interposers are substrates to which components are attached as an intermediate step prior to direct attachment to a substrate, e.g. PCB. Interposers have many uses. They are frequently used to adapt obsolete components to a circuit board that is impossible or impractical to redesign. ÅAC Microtec offers rapid design, prototyping and production of silicon interposers from smallscale to large-volume. All feature ÅAC Microtec’s proprietary through-silicon via (TSV) technology XiVIA™, which is compatible with today’s MEMS foundry equipment. They are excellent for handling fine-pitch bare die like FPGAs and ASICs on lowcost substrates such as LTCC, HTCC, PCB, etc. The interposers translate the fine soldering pad pitch to a standard footprint, e.g. a 500 μm pitch, or a larger pitch BGA or LGA footprint. The ÅAC Microtec interposer with XiVIA™ TSV adapts the complex substrate to the standard footprint by re-routing on the interposer.

A complex module with several bare die or other components needs to be mounted to a standard footprint. To achieve this, the interposer adapts the complex substrate to the standard footprint by re-routing on the interposer. This solution also permits very effective future upgrades since the top substrate can easily be changed. It can, for example, be upgraded with newer IC circuitry and still be compatible with the original footprint. Interposers can be selected in thicknesses from 100 μm to 800 μm. Applications for ÅAC Microtec XiVIA technology include interposers, MCM/SiP, single devices and taking 2D systems to 3D integration. Interposers find use in areas such as wafer-level packaging, wafer-to-wafer, MEMS packaging and hermetic sealing. Compared with breadboard versions on PCBs built with encapsulated components, XiVIA dramatically improves the performance of MCM/SiP
modules.

XiVIA overcomes the drawbacks of ordinary TSV techniques

Through-silicon via (TSV) is finding increasing use in microelectronics. By offering higher numbers of  IOs, shorter signal paths, hermetic sealing, better impedance control and smaller footprints, the technology meets many semiconductor and MEMS industry demands. Besides being thermally strong, XiVIA also saves costs thanks to its tremendous yield and good compatibility with other processing. Plating time is typically 10–100 times shorter than regular manufacturing, for example. XiVIA opens up many 2D and 3D SysteminPackage (SiP) opportunities for the space and interposer industry. It has already been successfully applied for manufacturing fine-pitch  component interposers. This interposer features electrical TSVs through both silicon substrate and interposer, Flip-Chip-mounted bare dies, passive components mounted as SMD, and soldered wafer-to-wafer interconnections.

The following pictures shows and interposer design and manufactured by Ã…AC Microtec for a high power H-bridge module for magnetic attitude control of spacecraft. The interposer translates a three (3) H-bridge substrate to a standard 525 pad BGA interface.

 

Download Interposer and XiVIA® data sheet (PDF)

ÅAC offers rapid design, prototyping, and production ranging from small scale to large volume of silicon interposers. The interposers features ÅAC proprietary through silicon via (TSV) technology, XiVIA®, which is compatible with today's MEMS foundry equipment. Contact us today to get a quoute for a silicon interposer of your needs