ÅAC Microtec’s unique systems-of-microsystems are so small, light and robust that you can use them in completely new ways.

For example, they can be placed on turbine blades or train wheels to provide real-time ubiquitous monitoring. No larger than a cigarette filter, they can provide in-situ torque monitoring in axles, or distributed intelligence in the joints of robotic arms.

ÅAC MIcrotec offers Wafer Level Packaging (WLP) and System-In-Package (SiP) custom solutions bringing breakthrough advantages for tomorrow’s space-saving technology-driven applications. We have a robust proprietary through silicon via (TSV) technology, XiVIA®, that enable true 3D packaging on wafer level.

Our technology offer responds to a diverse range of needs and requirements going from low volume-space qualified up to high volume-industrial applications.