Ubiquitous sensoring

With extremely small MEMS sensors and 3D-packaged electronics you can place sensors virtually anywhere. For example, you could monitor equipment in harsh environments, in real-time, to help increase reliability and uptime.

System redundancy

Due to the small size and weight of our products, it is simple to build redundancy in critical applications.

Robust

The lighter the system, the less it is effected by mechanical vibration and acceleration. Thanks to our space heritage, our products have been designed from the outset to withstand extreme conditions.

Heat management

ÅAC Microtec systems are based on silicon or ceramic substrates which offer far superior heat management than conventional PCB technology. In addition, our products can tolerate extreme temperature swings (-120 °C to 125 °C) due to the materials and proprietary processes used.

Faster, more efficient

We achieve a high package density by stacking vertically. This results in fewer interconnect routing problems, less time delay for high speed signals (reduced crosstalk), less thermal problems, plus a more robust system. In other words, our technology provides excellent performance/mass/volume ratios.

Multifunctional and easy to integrate

Despite their small size, our products are flexible and easy to integrate. For example, our RTU-100 can function either as an onboard computer with redundant interfaces or as a standard interface module with plug-and-play capabilities.