RUBIN 9.2, Planned launch in second half of 2009 from India.

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Ã…AC has delivered a complete nanosatellite architecture called INOVATOR(TM) based on advanced packaging to the OHB Systems built RUBIN 9.2 technology validation platform.

The hardware has been shipped to India and awaiting launch on the next PLSV vehicle. RUBIN 9.2 will be launched with the primary payload, OceanSat 2.

INOVATOR uses a distributed architecture, with command and time synchronization sent over Controller Area Network (CAN) bus and high speed memory access over SpaceWire. The following figure show the INOVATOR block diagram.

The key "glue" logic of INOVATOR is the Remote Terminal Unit (RTU). It act as the redudant on-board computers (OBC), controlling the INOVATOR. It also act as a general spacecraft interface for the pulse width modulation (PWM) modules that control the magnetic attitude simulation loads. The next figure shows a photograph of the INOVATOR flight hardware redunant on-board computer box.

A key demonstration on INOVATOR is to combine Ã…AC's new packaging technology with tradiational space electronics. Ã…AC teamed up with RUAG Space (f.m. Saab Space) to demonstrate a miniaturized version of the memory modules that RUAG developed for ESA's Herschel and Planck missions. The figure below shows a photograph of the Ã…AC/RUAG developed solid state mass memory module.

INOVATOR is the first payload in space that demonstrate 3D stacked silicon wafers with through silicon via (TSV) technology. ÅAC developed a miniaturized magnetic attitude driver module (MACS) which consists of a silicon interposer and a silicon wafer substrate equipped with H-bridges and filters. The MACS module is shown to the left in the following picture.  ÅAC's proprietary XiVIA(R) low-resistive through silicon via was used to enable 3D stacking.

Read more about the INOVATOR payload and the results from space by downloading this publication.